Investigation of electrical contact resistance for nonconductive film functionalized with Π -conjugated self-assembled molecules

©2007 American Institute of Physics. The electronic version of this article is the complete one and can be found online at: http://link.aip.org/link/?APPLAB/90/092102/1DOI:10.1063/1.2709638Nonconductive adhesive/nonconductive film (NCA/NCF) bonding technology has attracted increasing research interests as lead-free interconnect. During bonding, heat and pressure are applied and the direct physical contacts between the two surfaces of integrated circuit bump and substrate bond pad can be achieved. The electrical contact resistance of a NCA/NCF joint is controlled by the pressure, roughness and NCA/NCF material properties. An accurate prediction of contact resistance can help guide experiment setup towards improving the electrical performance of NCA/NCF. In this study, a model is developed and correlated to experiments. The effects of NCA/NCF material properties on electrical contact resistance are investigated

Processing of carbon-fiber-reinforced Zr41.2Ti13.8Cu12.5Ni10.0Be22.5 bulk metallic glass composites

Carbon-fiber-reinforced bulk metallic glass composites are produced by infiltrating liquid Zr41.2Ti13.8Cu12.5Ni10.0Be22.5 into carbon fiber bundles with diameter of the individual fiber of 5 mum. Reactive wetting occurs by the formation of a ZrC layer around the fibers. This results in a composite with a homogeneous fiber distribution. The volume fraction of the fibers is about 50% and the density of the composite amounts to 4.0 g/cm(^3)

Void Formation Study of Flip Chip in Package Using No-Flow Underfill

©2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or distribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.DOI: 10.1109/TEPM.2008.2002951The advanced flip chip in package (FCIP) process using no-flow underfill material for high I/O density and fine-pitch interconnect applications presents challenges for an assembly process that must achieve high electrical interconnect yield and high reliability performance. With respect to high reliability, the voids formed in the underfill between solder bumps or inside the solder bumps during the no-flow underfill assembly process of FCIP devices have been typically considered one of the critical concerns affecting assembly yield and reliability performance. In this paper, the plausible causes of underfill void formation in FCIP using no-flow underfill were investigated through systematic experimentation with different types of test vehicles. For instance, the effects of process conditions, material properties, and chemical reaction between the solder bumps and no-flow underfill materials on the void formation behaviors were investigated in advanced FCIP assemblies. In this investigation, the chemical reaction between solder and underfill during the solder wetting and underfill cure process has been found to be one of the most significant factors for void formation in high I/O and fine-pitch FCIP assembly using no-flow underfill materials

Buyers-to-shoppers ratio of shopping malls: A probit study in Hong Kong

Buyers-to-shoppers ratio (i.e. conversion rate) has long been one of the commonly adopted metrics in assessing retail performance of shopping malls, but it is almost always relied on interviews, consumer surveys, and questionnaires. These methods are intrinsically problematic in ascertaining the trustworthiness of the responses. This paper is probably the first objective study on the buyers-to-shoppers ratio based on actual observations in shopping malls in Hong Kong. A probit model is used to study factors affecting the ratio. The results show that consumer-surveys seriously over-estimate the ratio. © 2010 Elsevier Ltd.postprin

Ubiquitous Internet in an integrated satellite-terrestrial environment: The SUITED solution

yesThe current Internet architecture appears to not be particularly suited to addressing the emerging needs of new classes of users who wish to gain access to multimedia services made available by ISPs, regardless of their location, while in motion and with a guaranteed level of quality. One of the main objectives of so-called nextgeneration systems is to overcome the limitations of today¿s available Internet by adopting an approach based on the integration of different mobile and fixed networks. The SUITED project moves in this direction since it aims at contributing to the design and deployment of the global mobile broadband system (GMBS), a unique satellite/terrestrial infrastructure ensuring nomadic users access to Internet services with a negotiated QoS. A description of the main features of the GMBS architecture, characterized by the integration of a multisegment access network with a federated ISP network is given in this article. The GMBS multimode terminal is schematically described, and an overview of the so-called QoS-aware mobility management scheme, devised for such a heterogeneous scenario,is provided

Quantum Mechanical Metric for Internal Cohesion in Cement Crystals

This is the published version. Copyright 2014 Nature Publishing Group.Calcium silicate hydrate (CSH) is the main binding phase of Portland cement, the single most important structural material in use worldwide. Due to the complex structure and chemistry of CSH at various length scales, the focus has progressively turned towards its atomic level comprehension. We study electronic structure and bonding of a large subset of the known CSH minerals. Our results reveal a wide range of contributions from each type of bonding, especially hydrogen bonding, which should enable critical analysis of spectroscopic measurements and construction of realistic C-S-H models. We find the total bond order density (TBOD) as the ideal overall metric for assessing crystal cohesion of these complex materials and should replace conventional measures such as Ca:Si ratio. A rarely known orthorhombic phase Suolunite is found to have higher cohesion (TBOD) in comparison to Jennite and Tobermorite, which are considered the backbone of hydrated Portland cement